About This Item
Overview
Details
Digi ConnectCore® 8X delivers a secure and cost-effective connected system-on-module platform that measures in at just 40 mm x 45 mm. The Digi SMTplus® surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.Built on the NXP® i.MX 8X application processor
The module is the intelligent communication engine for todayís secure connected devices. Digi ConnectCore 8X can help jump-start the development of streaming video/audio devices, voice control and general human-machine interface solutions. With a multitude of high performance interconnecting options, including 1x USB 3.0 port, dual Gigabit Ethernet, PCIe 3.0, and pre-certified dual-band 2x2 MU-MIMO WLAN, ConnectCore 8X is ideal for developing a wide range of embedded and IoT applications.
Documentation
PDF Data Sheet- PDF Hardware Reference Manual
- 4x Cortex®-A35 cores @ 1.2 GHz
- 1x Cortex-M4F @ 266 MHz core for real-time processing
- 1x Tensilica® Hi-Fi 4 DSP
- 2x Cortex®-A35 cores @ 1.2 GHz
- Independent Cortex-M0+ microcontroller subsystem
- Supporting ultra-low power modes @ <3µA
| SPECIFICATIONS | Digi ConnectCore® 8X | Digi ConnectCore® 8X Dual |
|---|---|---|
| APPLICATION PROCESSOR |
NXP® i.MX8QuadXPlus
|
NXP® i.MX8DualXZ
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| MEMORY | Up to 64 GB eMMC, up to 4 GB of LPDDR4 | |
| PMIC | NXP PF8100 | |
| GRAPHICS | Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders | H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders |
| SECURITY | Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP) | |
| PERIPHERALS/ INTERFACES** |
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx, 8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG |
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx, 8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG |
| ETHERNET | 2x 10/100/1000M Ethernet + AVB | |
| WI-FI |
802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm) 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7 802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9 Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate. Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready |
|
| BLUETOOTH | Bluetooth® 5 | |
| ON-MODULE MICROCONTROLLER ASSIST |
Digi Microcontroller Assistô
|
|
| OPERATING TEMPERATURE | Industrial: -40∞ C to 85∞ C (-40∞ F to 185∞ F) (depending on use case and enclosure/system design) | |
| STORAGE TEMPERATURE | -50∞ C to 125∞ C (-58∞ F to 257∞ F) | |
| RELATIVE HUMIDITY | 5% to 90% (non-condensing) | |
| RADIO APPROVALS | US, Canada, EU, Japan, Australia/New Zealand | |
| EMISSIONS/ IMMUNITY/ SAFETY |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3 |
|
| DESIGN VERIFICATION |
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
|
| MECHANICAL DIMENSIONS | 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm | |
| PRODUCT WARRANTY | 3-year | |
Features
- Industrial i.MX 8X quad/dual-core SOM and SBC platform family
- Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
- Power management with both hardware and software support for low-power designs
- Multi-display and camera capabilities with hardware acceleration
- Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth® 5 connectivity
- Seamless cellular modem and Digi XBee® 3 integration
- Cloud and edge-compute services integration
- Built-in device security with Digi TrustFence®
- Yocto Project® Linux® and Androidô support
