About This Item
Overview
Details
Digi XBee-PRO® Zigbee RF modules provide cost-effective wireless connectivity to electronic devices. They are interoperable with other Zigbee Pro feature set devices, including devices from other vendors. Digi XBee-PRO Zigbee modules are ideal for applications in the energy and controls markets where manufacturing efficiencies are critical.The Serial Peripheral Interface (SPI) provides a highspeed interface and optimizes integration with embedded microcontrollers, lowering development costs and reducing time to market. Digiís Zigbee compatible module uses a Silicon Labs EM357 SoC with a 32-bit ARM® Cortex® M3 processor.
Documentation
- PDF Data Sheet
| SPECIFICATIONS | Digi XBee-PRO Zigbee |
| PERFORMANCE | |
| TRANSCEIVER CHIPSET | Silicon Labs EM357 SoC |
| DATA RATE | RF 250 Kbps, serial up to 1 Mbps |
| INDOOR/URBAN RANGE* | Up to 90 m (300 ft) |
| OUTDOOR/RF LINE-OF-SIGHT RANGE* | Up to 3200 m (2 miles) |
| TRANSMIT POWER | 63 mW (+18 dBm) |
| RECEIVER SENSITIVITY (1% PER) | -101 dBm |
| FEATURES | |
| SERIAL DATA INTERFACE | UART, SPI |
| CONFIGURATION METHOD | API or AT commands, local or over-the-air (OTA) |
| FREQUENCY BAND | ISM 2.4 GHz |
| FORM FACTOR | Surface mount |
| INTERFERENCE IMMUNITY | DSSS (Direct Sequence Spread Spectrum) |
| ADC INPUTS | (4) 10-bit ADC inputs |
| DIGITAL I/O | 18, no RSSI PWM |
| ANTENNA OPTIONS | SMT: RF pad, PCB antenna, or U.FL connector |
| OPERATING TEMPERATURE | -40∫ C to 85∫ C (-40∫ F to 185∫ CF) |
| DIMENSIONS (L X W X H) AND WEIGHT | SMT: 2.199 x 3.4 x 0.305 cm (0.866 x 1.33 x 0.120 in) |
| NETWORKING AND SECURITY | |
| PROTOCOL | Zigbee PRO 2007, HA-Ready with support for binding/multicastingc |
| ENCRYPTION | 128-bit AES |
| RELIABLE PACKET DELIVERY | Retries/Acknowledgements |
| IDS | PAN ID and addresses, cluster IDs and endpoints (optional) |
| CHANNELS | 15 channels |
| POWER REQUIREMENTS | |
| SUPPLY VOLTAGE | 2.7 to 3.6 V |
| TRANSMIT CURRENT | 115 mA @ 3.3 VDC |
| RECEIVE CURRENT | 34 mA @ 3.3 VDC |
| POWER-DOWN CURRENT | <1 μA @ 25∫ C (77∫ F) |
| REGULATORY APPROVALS | |
| FCC, IC (NORTH AMERICA) | Yes |
| ETSI (EUROPE) | No |
| RCM (AUSTRALIA AND NEW ZEALAND) | No |
Features
- Surface mount form factors enable flexible design options
- Link budgets of 110 dB for Digi XBee and 119 dB for Digi XBee-PRO
- Industry-leading sleep current
- Firmware upgrades via UART, SPI or over the air (OTA)
- Turnkey development available from Digi WDS
